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Pre-spring lab clean! (and o-rings)
Let’s get a blast-from-the-past and go through a bunch of drawers in the lab! I spoke with Jim and it seems like it might be best to schedule it during next regularly slotted Tuesday NRG mtg. So let’s plan on meeting downstairs in the lab on 2-19 at 9:45 am. Also, I bought an assortment…
CMFDA Dye Potentially Harms Cells
Invitrogen offers a number of stains and dyes for use in tracking cells and fluorescent imaging of tissue culture. One prevalent live stain is called CMFDA (5-Chloromethylfluorescein Diacetate), a green fluorescent molecular probe. This stain is utilized for tracking cells and monitoring growth & viability of the cells. While performing studies using CMFDA, there appears…
TEER and Pinholes
One of Christine’s projects was to determine if pinholes affected electrical resistance (TEER) measurements. She summarized her work here. I collected her data and did some negative controls to finish this work up. Here’s the graph: The “no membranes” data is from Sepcon transwells with pnc-Si chips but without membranes (I broke them before assembling…
Membrane Anneal Study: W510X, W600 Testing
I recently tested W510X and W600 described by Dave here for air permeability, rhodamine diffusion, and burst pressure. No air permeability was observed; even a sample with one very small pinhole (W600 800C anneal) only had a permeability of 11 cc/atm*cm2*s. To verify the lack of pores I performed rhodamine diffusion on the W600 700C…
Production from 12.13.2007
Production this week focused on varying the RTP temperature of membranes deposited under identical conditions. wafer 316 – 800 C RTP (120 s) (0,-5) @ 50 kx Material still appears to be amorphous. Wrinkled at edges. wafer 318 – 900 C RTP (120 s) (0, 0) @ 50kx (-5, 0) @ 50kx A few, very…
Booth and Kim (2012) micro-BBB device
Here is the paper I reviewed at the NRG meeting on 06/19. Utah Group Micro BBB Device I’ve also included my presentation: BBB Device Presentation This week I’m working on designing the basal and apical chambers, considering the necessary shear stresses.